Absolute Maximum Ratings (T A = 25°C unless otherwise speci?ed)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
T OPR
T STG
T SOL-I
Parameter
Operating Temperature
Storage Temperature
Soldering Temperature (Iron) (2,3,4)
Rating
-40 to +85
-40 to +90
240 for 5 sec
Units
°C
°C
°C
T SOL-F
Soldering Temperature
(Flow) (2,3)
260 for 10 sec
°C
EMITTER
I F
V R
Continuous Forward Current
Reverse Voltage
50
5
mA
V
I FP
Peak Forward
Current (5)
1
A
P D
Power
Dissipation (1)
75
mW
SENSOR
V CEO
V ECO
I C
P D
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Current
Power Dissipation (1)
30
5
20
50
V
V
mA
mW
Electrical/Optical Characteristics (T A = 25°C unless otherwise speci?ed)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
INPUT DIODE
V F
Forward Voltage
I F = 20mA
1.2
1.6
V
I R
λ PE
Reverse Leakage Current
Peak Emission Wavelength
V R = 5V
I F = 20mA
940
10
μA
nm
OUTPUT TRANSISTOR
I D
Collector-Emitter Dark Current
I F = 0mA, V CE = 20V
100
nA
COUPLED
I C(ON)
On-State Collector Current
I F = 20mA, V CE = 5V (6)
0.10
0.40
mA
I CX
V CE (SAT)
Cross-Talk Collector Current
Saturation Voltage
I F = 20mA, V CE =
5V (7)
1
0.3
μA
V
t r
t f
Rise Time
Fall Time
V CC = 5V, I C(ON) = 100μA,
R L = 1k ?
20
20
μs
Notes:
1. Derate power dissipation linearly 1.00mW/°C above 25°C.
2. RMA ?ux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16" (1.6mm) from housing.
5. Pulse conditions: tp = 100μs; T = 10ms.
6. Measured using an aluminum alloy mirror at d = 1mm.
7. No re?ective surface at close proximity.
?2011 Fairchild Semiconductor Corporation
QRE1113, QRE1113GR Rev. 1.7.1
3
www.fairchildsemi.com
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